Removal of 10-nm contaminant particles from Si wafers using CO2 bullet particles
نویسندگان
چکیده
منابع مشابه
Removal of 10-nm contaminant particles from Si wafers using CO2 bullet particles
Removal of nanometer-sized contaminant particles (CPs) from substrates is essential in successful fabrication of nanoscale devices. The particle beam technique that uses nanometer-sized bullet particles (BPs) moving at supersonic velocity was improved by operating it at room temperature to achieve higher velocity and size uniformity of BPs and was successfully used to remove CPs as small as 10 ...
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Contaminant control is becoming a major issue of nanoscale device. Cryogenic aerosol beam using micron-sized aerosol particles has long been successfully used to remove contaminant particles (CPs) down to 50nm, and supersonic particle beam using particles smaller than 100nm lowered the limit of cleaning down to 20nm size. In this study, the supersonic particle beam technique that uses nanometer...
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ژورنال
عنوان ژورنال: Nanoscale Research Letters
سال: 2012
ISSN: 1556-276X
DOI: 10.1186/1556-276x-7-211